Onto Innovation

Onto Innovation

1mo

We’re excited to share that Onto Innovation has announced a strategic partnership with Rigaku, a global leader in X-ray technology, to advance next-generation process control solutions for semiconductor manufacturing. As device architectures become more complex and incorporate new and exotic materials across advanced logic, memory, and packaging, customers are increasingly looking for deeper, more precise insight into their processes. By integrating Onto Innovation’s Ai Diffract™ analysis software with Rigaku’s critical-dimension small-angle X-ray scattering (CD‑SAXS) platforms, this collaboration brings together the speed and location intelligence of optical metrology with the structural precision of X-ray techniques—especially for deeper and more complex features. The joint solution has already been selected by key customers and addresses a market opportunity estimated by external analysts to exceed $1B over the next five years. Building on this technical collaboration, Onto Innovation has also entered into an agreement to acquire a 27% equity stake in Rigaku, further strengthening strategic alignment, accelerating joint IP development, and supporting a coordinated go-to-market strategy. This milestone reflects the impact of our teams’ innovation and collaboration, and reinforces our shared commitment to helping customers solve their toughest yield, performance, and reliability challenges as the industry moves into the most advanced technology nodes....Mehr anzeigen

Onto Innovation

1y

Onto Innovation announced advances in its product suite for 3D interconnect process control, featuring the new 3Di™ technology on the Dragonfly® G3 system for bump process control in high bandwidth memory (HBM) and advanced logic applications. Additionally, the EchoScan™ system is introduced for detecting voids as small as 1µm in wafer bonding applications, such as advanced hybrid bonding for Cu-Cu interconnects. “High-performance HBM and GPU devices powering AI packages demand smaller line/space and bump pitch requirements,” says Mike Rosa, Onto’s CMO and SVP of strategy. “Onto designed the 3Di technology to meet customers’ needs for more stable technologies accommodating smaller bump sizes—even below 5µm in HVM and 2µm in R&D—in next generation logic and memory devices.” Interconnect density intensifies with the adoption of hybrid bonding for bond pad interconnects, with planar bump heights and the challenge of inline micro void detection at the Cu-Cu bond pad interface. Undetected voids can lead to wafer cracking and open electrical connections, resulting in yield loss. “Onto’s EchoScan system offers die and wafer level, immersion free, non-contact technology for voids down to 1µm in HVM. This solution is being released to select customers to detect 1µm voids in atmosphere at the same speed as incumbent technologies limited to ~10µm,” Rosa added. “Whether using micro bump or hybrid bonding technologies, Onto Innovation provides the critical process control solution."...Mehr anzeigen

Onto Innovation

1y

Onto Innovation celebrated the grand opening of the Packaging Applications Center of Excellence, or PACE, at Onto Headquarters in Wilmington, Mass. on Sept. 30, 2024. Alongside industry collaborators, customers, local government representatives, academia and more, we introduced and celebrated this new advanced manufacturing space with our Onto community. PACE will allow manufacturers to co-develop advanced chiplet integration architectures and high-performance packages with Onto and its collaboration partners, such as ASMPT Ltd, Corning Incorporated, Evatec AG, Lam Research, LPKF Laser & Electronics SE, MKS Instruments, Resonac, Taiyo America, Inc., and more. To kick off the event, CEO Mike Plisinski emphasized the global economic impact of artificial intelligence (AI). On the horizon, semiconductor industry revenue through AI is predicted to reach $1 trillion by 2030. However, new compute designs will drive larger package sizes and require denser interconnects. That’s where panels come in. With industry collaboration for panel development, especially in support of glass core substrates, we will be able to accelerate this new era of AI technology. After opening remarks, attendees were guided through the different features of PACE. This set the scene to officially mark the opening of PACE with a ceremonial ribbon cutting. The event concluded with a tour inside the cleanroom where attendees gowned up to experience live tool demonstrations. Learn more:pace@ontoinnovation.com...Mehr anzeigen

Onto Innovation

1y

Congratulations to the Onto Innovation team for receiving the Gold Safety Award from Highwire, the Contractor Success platform for builders and owners of capital projects. The Gold Safety award is presented to companies who score between 85-94 on the Safety Assessment administered by Highwire. "Management systems are critical to any company's ability to deliver successful outcomes and, most importantly, to keep their employees safe. Onto Innovation has done a remarkable job implementing a strong safety management system resulting in exceptional safety performance and results," says David Tibbetts, CSP, Highwire’s Chief Safety Officer. Highwire’s Safety Assessment reviews a company’s historic and current safety performance. The program provides a thorough, objective, and consistent evaluation of company performance so clients and contractors can identify, monitor, and mitigate risks more effectively. The results provide a strong indicator of how a contractor values safety and serve as a reliable predictor of future performance....Mehr anzeigen

Onto Innovation

1y

Happy National Intern Day! Our Onto Innovation interns have been hard at work all summer long working on a variety of projects within operations, quality, engineering, marketing, and more. They have joined us from universities across the country eager to learn about Onto Innovation’s leading products with the help of our Onto mentors. As our program grows, we continue to see the impact the intern season has on our industry youth and the company itself. “Here at Onto, every day I get to learn something new, something I wouldn't ever learn in a classroom,” said electrical automation engineering intern, Anastasia Lindquist. “I'm really lucky to be able to have a chance to gain those types of experiences.” Anastasia joins Onto as rising junior from Northeastern University where she is majoring in Computer Engineering and Computer Science. When asked about her favorite part of the internship, she highlighted the applicable nature of her position. The very components used here at Onto Innovation within our tools, she had seen in her major classes, bringing her studies full circle. As our other interns reflected on their time here, the common theme amongst them all was gratitude. They have experienced a magnitude of generosity from their coworkers and have felt appreciated for their work. We thank them for joining Onto Innovation and wish them well as they enter the final month of their internships and beyond....Mehr anzeigen